Fully automatic ACF Bonding System

ACF Fully Automatic

NEW CMS-2110 Fully automatic ACF bonding machine (for camera module)

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Achieving high productivity (UPH 1350) as a FOB ACF bonding process for camera modules.
The newly designed mechanism of each unit of ACF lamination, FPC alignment mounting, and main bonding improves productivity and bonding quality.

Model CMS-2110
Fully automatic ACF bonding machine
Process FOB

CMS-1500 Fully automatic ACF bonding machine (for camera module)

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All-in-one fully automatic FOB machine of ACF lamination, FPC mounting and final bonding.
Achieving high productivity (UPH 1250) as a FOB ACF bonding process for camera modules.


Model CMS-1500
Fully automatic ACF bonding machine
Process FOB

FAS-1900　 Fully automatic FOG bonder

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A fully automatic FOG machine suitable for FPC bonding onto a touch sensor panel.
Not only for stand-alone use, it is also possible to connect loaders and unloaders and inline them.

Model FAS-1900
Fully automatic FOG bonder
Process FOG、FOF

CFS-1400　Fully automatic COF bonder

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All-in-one fully automatic COF machine of ACF lamination, FPC mounting and final bonding.
ACF is attached to a FPC and a IC chip is mounted on FPC automatically.


Model CFS-1400
Fully automatic COF bonder
Process Process COF（Chip on FPC）

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