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ACF Bonding System
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Si Business System Integration
- February.3 2023 exhibition
- Exhibit at 37th NEPCON JAPAN
- December.6 2022 exhibition
- Exhibit at 37th NEPCON JAPAN
- March.15 2022 Product
- OH-251 FPC bonding equipment for large FPCs is added.
- January.28 2022 exhibition
- Exhibit at 36th NEPCON JAPAN
- December.1 2021 exhibition
- Exhibit at 36th NEPCON JAPAN
- February.13 2020 Company
- New factory expansion and start of operation
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COMPANY
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RECRUIT
Developed bonding machine from manual equipment
to fully automatic equipment
Ohashi Engineering Co., Ltd., a mounting equipment manufacturer, develops, manufactures, and sells ACF mounting equipment and automation equipment.
From manual desk machines to fully automatic mass production lines, we will propose the most suitable equipment for your needs based on the latest technology.
We have a sales record of more than 450 companies in more than 20 countries around the world.
